small signal product - fast switching speed - surface mount device type - moisture sensitivity level 1 - matte tin (sn) lead finish with nickel (ni) underplate - pb free version and rohs compliant - packing code with suffix "g" means green compound (halogen-free) - case: sot-23 small outline plastic package - weight: 8 0.5 mg symbol unit p d mw v rrm v i frm ma i o ma r ja o c/w t j , t stg o c symbol unit reverse breakdown voltage v (br) v c j pf reverse recovery time i f =i r =30ma, r l =100 ? , i rr =0.1i r t rr ns document number: ds_s1501010 version: b15 value mmbd3004/ca/cc/se taiwan semiconductor 350mw, smd switching diode features sot-23 mechanical data power dissipation 350 350 v f - terminal: matte tin plat ed, lead free., solderable per mil-std-202, method 208 guaranteed - high temperature soldering guaranteed : 260c/10s maximum ratings and electrical characteristics (t a =25c unless otherwise noted) parameter a 1 357 625 225 repetitive peak reverse voltage -65 to +150 min max mean forward current repetitive peak forward current 4 350 - forward voltage -1.00 i f =200ma i f =100ma i r =100 a v -1.25 reverse leakage current -0.1 a v r =240v 100 junction capacitance -5 v r =1v, f=1.0mhz v r =240v, t j =150 o c i r -50 parameter i fsm non-repetitive peak forward surge current pulse width=1s pulse width=1 s junction and storage temperature range thermal resistance (junction to ambient) -
small signal product (t a =25c unless otherwise noted) document number: ds_s1501010 version: b15 mmbd3004/ca/cc/se taiwan semiconductor ratings and characteristics curves 0.001 0.01 0.1 1 10 100 1000 00.511.522.533.5 instantaneous reverse current (ma) instantaneous reverse voltage (v) fig. 2 typical reverse characteristics 0.7 0.8 0.9 1.0 1.1 0.01 0.1 1 10 100 c t , total capacitance (pf) reverse voltage (v) fig. 4 typical capacitance vs. reverse voltage 0 50 100 150 200 250 300 350 400 0 25 50 75 100 125 150 175 200 power dissipation (mw) ambient temperature ( o c) fig. 3 admissible power dissipation curve 0.01 0.1 1 10 100 1000 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 instantaneous forward current (ma) instantaneous forward voltage (v) fig. 1 typical forward characteristics
package outline dimensions min max min max a 2.70 3.10 0.106 0.122 b 1.10 1.50 0.043 0.059 c 0.30 0.51 0.012 0.020 d 1.78 2.04 0.070 0.080 e 2.10 2.64 0.083 0.104 f 0.89 1.30 0.035 0.051 g h suggest pad layout z x y c e pin configuration marking marking hc ra pz py document number: ds_s1501010 version: b15 1.0 0.039 order information (example) part no. sot-23 0.7 0.028 0.9 0.035 1.9 0.075 dim. unit (mm) unit (inch) typ. typ. 2.8 0.110 dim. unit (mm) unit (inch) 0.55 ref 0.022 ref 0.10 ref 0.004 ref mmbd3004 mmbd3004ca mmbd3004cc MMBD3004SE mmbd3004/ca/cc/se taiwan semiconductor small signal product mmbd3004 rfg green compound ? code packing ? code part ? no.
small signal product assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_s1501010 version: b15 mmbd3004/ca/cc/se taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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